Mainly used for the preparation of III-V compound semiconductors, high-purity alloys, ultra-low temperature cooling, transistor bases, doping agents for germanium and silicon single crystals, indium sealing, ITO, nuclear radiation safety monitoring, electrical contact components, solder, etc.
Call the national toll-free hotline for more details
99.99% indium ingots, indium beads, indium particles, indium powder
Technical docking: electrolysis melting (removing low melting point lead, arsenic, cadmium, phosphorus, mercury, sulfur, selenium, etc.)
Inspection: ICP-MS; GDMS.
Service: Provide practical protective measures and material application solutions.
1. Physical properties:
Atomic mass: 114.818
Electronegativity: 1.78
Density: 7.31 g/cm3 (20 ℃) (0-100 ℃)
Melting point: 156.5985 ℃
Boiling point: 2072 ℃
2. Specifications:
Chemical purity:
High purity indium: In-05 has a purity of over 99.999%, and the total impurity content of silver, aluminum, arsenic, cadmium, copper, iron, magnesium, nickel, lead, sulfur, silicon, tin, thallium, and zinc is less than 10ppm;
Ultra pure indium: In-06 with a purity of over 99.9999%, with a total impurity content of less than 1ppm in cadmium, copper, iron, magnesium, lead, sulfur, silicon, and tin;
Ultra high purity indium: In-07 has a purity of over 99.9999%, and the total impurity content of silver, cadmium, copper, iron, magnesium, nickel, lead, and zinc is less than 0.1ppm;
3. Physical properties: rod, ingot, tablet, pellet, pill.
4. Purpose:
Mainly used for the preparation of III-V compound semiconductors, high-purity alloys, ultra-low temperature cooling, transistor bases, doping agents for germanium and silicon single crystals, indium sealing, ITO, nuclear radiation safety monitoring, electrical contact components, solder, etc.
5. Packaging: Polyester film packaging followed by plastic film vacuum packaging or polyethylene bottle vacuum packaging.