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Bismuth
DESCRIPTION
Product Introduction：

It is mainly used in the production of Compound semiconductor, high purity alloys, electronic cooling devices, thermoelectric conversion devices and liquid cooling carriers in atomic reactors.

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Bismuth
Overview

Bismuth（Bi）

Technology docking： Electrolysis-zone melting

Inspection：ICP-MS；Laser particle size analyzer, scanning electron microscope。

Services: provide practical protective measures, provide material application solutions。

4、Purpose：

 

It is mainly used in the production of Compound semiconductor, high purity alloys, electronic cooling devices, thermoelectric conversion devices and liquid cooling carriers in atomic reactors

。

5、Packaging：Polyester film packaging, plastic film vacuum packaging。


Technical Parameter

1、Physical properties：

Atomic weight：208.98040

Electronegativity：1.9

Density：9.78 g/cm3

Melting Point：271.50 ℃

Boiling Point：1564 ℃

2、Specifications：

Chemical purity：

High-purity bismuth：Bi-05 The purity is over 99.999%，The total impurity contents of Ag, Al, as, AU, CD, CR, Cu, Fe, Mg, Ni, Pb, Sn, Zn are less than 10 ppm；

Ultra-pure bismuth：Bi-06 The purity is over 99.999% ，The total impurity contents of Ag, Al, as, AU, CD, Cu, Fe, Mg, Ni, Pb, Zn are less than 1ppm.

3、Physical properties: ingots, powders, pills, grains, needles, etc.


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