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Tin Prill
Tin Prill
tin
DESCRIPTION
Product Introduction：

6N tin, 99.9999% tin particles (Sn) 7440-31-5

High purity tin (Sn) Tin



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tin
Overview

Purpose:

Mainly used for preparing group compound semiconductors (such as PbxSn1-xTe), high-purity alloys, ultra-low temperature cooling alloys, superconducting materials (Nb2Sn), solder, and dopants for compound semiconductors. ITO materials and other basic materials.

Packaging: Polyester film packaging followed by plastic film vacuum packaging or glass tube vacuum packaging.



Technical Parameter

1. Physical properties:

Atomic mass: 118.69

Melting point: 232 ℃

Boiling point: 2260 ℃

Electronegativity: 1.8-1.9

Silver white metal; α.β.γ Three variants.

2. Specifications:

Chemical purity:

High purity tin: Sn-05 has a purity of over 99.999%, and the total impurity content of silver, aluminum, arsenic, gold, bismuth, calcium, cobalt, copper, iron, indium, magnesium, nickel, and zinc is less than 10ppm;

Ultra pure tin: Sn-06 has a purity of over 99.9999%, with a total impurity content of less than 1ppm in silver, aluminum, gold, calcium, cobalt, copper, iron, magnesium, nickel, and zinc;

3. Physical properties: rod, ingot, tablet, powder, granule, pill.



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